PART |
Description |
Maker |
BZT52C5V1 BZT52C43 |
Planar Die Construction
|
SHENZHEN YONGERJIA INDU...
|
MM3Z18VS |
Planar Die Construction
|
TY Semiconductor Co., L...
|
MMBZ5228B |
Planar Die Construction
|
TY Semiconductor Co., L...
|
MMBZ5250B |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
MMBT2222 |
Epitaxial planar die construction
|
MAKO SEMICONDUCTOR CO.,...
|
BZT52C4V7T |
Planar Die Construction Ultra-Small Surface Mount Package
|
TY Semiconductor Co., Ltd
|
BZT52C30 BZT52C9V1 BZT52C2V0 |
Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current
|
TY Semiconductor Co., Ltd
|
GBJ35005 |
Glass passivated die construction
|
Sangdest Microelectroni...
|
MBR830 MBR860 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
|
MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd. Kersemi Electronic Co., Ltd...
|
CPL |
Commercial Power, Axial Lead, Fireproof Inorganic Construction, Complete Welded Construction, High Thermal Conductivity and Moisture Resistance for Aqueous Board Wash Systems
|
Vishay
|
TIP112F |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|